Description
Item Description:
Heat Sink, For Ball Grid Array, 22.5 °C/W, BGA, PLCC, 23 mm, 6.1 mm, 23 mm
Product Specs:
| Brand | Fischer Elektronik |
| MPN | ICK-BGA-23X23 |
| Model | ICK-BGA-23X23 |
|
Thermal Resistance |
22.5°C/W |
|
External Width – Metric |
23mm |
|
External Length – Metric |
23mm |
|
Heat Sink Material |
Aluminum |
|
External Height – Imperial |
0.24″ |
|
SVHC |
No SVHC (23-Jan-2024) |
|
Packages Cooled |
BGA, PLCC |
|
External Height – Metric |
6.1mm |
|
External Width – Imperial |
0.91″ |
|
External Length – Imperial |
0.91″ |
