Description
Item Description:
Cyclone® III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company (TSMC) low-power (LP) process technology, silicon optimizations and software features to minimize power consumption, Cyclone III device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications. To address the unique design needs, Cyclone III device family offers the following two variants: Cyclone III: lowest power, high functionality with the lowest cost, and Cyclone III LS: lowest power FPGAs with security. With densities ranging from 5K to 200K logic elements (LEs) and 0.5 Mbits to 8 Mbits of memory for less than ¼ watt of static power consumption, Cyclone III device family makes it easier for you to meet your power budget. Cyclone III LS devices are the first to implement a suite of security features at the silicon, software, and intellectual property (IP) level on a low-power and high-functionality FPGA platform. This suite of security features protects the IP from tampering, reverse engineering and cloning. In addition, Cyclone III LS devices support design separation which enables you to introduce redundancy in a single chip to reduce size, weight, and power of your application.
Product Specs:
| Brand | Intel |
| MPN |
EP3C25U256I7N |
| Model | Cyclone® III |
| Packaging | Tray |
| Package / Case | 256-LFBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Voltage – Supply | 1.15V ~ 1.25V |
| Number of Logic Elements/Cells | 24624 |
| Supplier Device Package | 256-UBGA (14×14) |
| Number of LABs/CLBs | 1539 |
| Total RAM Bits | 608256 |
| Number of I/O | 156 |
